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(PA) Polyamide Hot Melt Adhesive

Product No.：63428-83-1
Usage：Bonding of fabrics, leather, metals, and ceramics; protection of electronic components
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The polyamide resin hot melt adhesive series is made by high-temperature reaction of dimer acid and polyamine. It is soluble in general organic solvents, and its heated melt viscosity is closely related to the heating temperature. It has the characteristics of low viscosity, good flowability, good toughness, and high bonding strength.

Performance:

Good low-temperature solubility and solubility;

High thermal stability;

Strong flexibility.

Application:

1. Hot melt adhesive for shrinking materials of electronic appliances (such as automobile engine compartment);

2. Hot melt adhesive for shoes, clothing, leather, etc.;

3. Hot melt adhesive, etc.

Package and storage:

25KG/paper plastic bag

Main Spec:

Color (Fe-Co) ≤7#